Investment Used to Bring USB-C Multiprotocol Retimer Solution with USB4 Support to Market, Ongoing Development of Chord Signaling Technology, Glasswing SerDes IP LAUSANNE, Switzerland, November 17, 2020-- Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions, today closed its Series C round of funding, resulting in $92.3 million raised in the round. Participants in the funding include both existing investors, led by Bessemer Venture Partners, and two new investors, Climb Ventures, and Swiss Select Opportunities managed by Flexstone Partners. The total investment in the Company to date is $132.8 million.